<p>Electrical interconnect structures comprised of high temperature superconducting signal layers on a substrate bonded to one another or optionally to a base substructure containing power and ground planes and processes for their preparation are disclosed.</p>
申请公布号
EP0674808(B1)
申请公布日期
1997.03.26
申请号
EP19940904394
申请日期
1993.12.07
申请人
E.I. DU PONT DE NEMOURS AND COMPANY
发明人
DOROTHY, ROBERT, GLENN;FACE, DEAN, WILLETT;LAUBACHER, DANIEL, BRUCE
