发明名称 Sheilding of polymer casings
摘要 <p>A shielding process for a polymer moulded casing comprises initially sensitising the moulded polymer casing by exposure to infra-red radiation at 60 - 100 DEG C for 2 - 10 minutes applying a base coat primer; curing again by infra-red under the same conditions. The initial sensitising significantly improves the deposition rate for subsequent steps and the curing operation is significantly shorter than has heretofore been the case. Subsequently the cured casing is rinsed; activated; coded with copper by electroless deposition; initiated; and then coated with nickel by electroless deposition. A final chrome dipping with a 1.0% chrome solution may be carried out to reduce tarnishing of the finished casing. The products are used in electronic circuits and computers.</p>
申请公布号 GB2279364(B) 申请公布日期 1997.03.26
申请号 GB19930013418 申请日期 1993.06.29
申请人 * HITECH POP LIMITED 发明人 SENAN * BOLAND
分类号 C23C18/20;(IPC1-7):C23C18/18 主分类号 C23C18/20
代理机构 代理人
主权项
地址