发明名称 Method for radiofrequency wave etching
摘要 <p>A method for selective controlled etching of a material particularly by sequentially switching between two (2) or more modes of radiofrequency waves and/or by distance from a source of the microwaves. The modes and/or distance are selected depending upon the surface of the material to be etched. The etching is rapidly conducted at 0.5 mtorr to 10 torr, preferably using microwave plasma etching. <IMAGE></p>
申请公布号 EP0764968(A2) 申请公布日期 1997.03.26
申请号 EP19960112566 申请日期 1996.08.02
申请人 MICHIGAN STATE UNIVERSITY;SAINT-GOBAIN/NORTON INDUSTRIAL CERAMICS CORPORATION 发明人 REINHARD, DONNIE K.;ASMUSSEN, JES;CHAKRABORTY, RABINDRA N.;GOLDMAN, PAUL D.
分类号 H05H1/46;C23F4/00;C30B33/12;H01J37/32;H01L21/302;H01L21/3065;(IPC1-7):H01J37/32 主分类号 H05H1/46
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