| 发明名称 |
SELF TOOLING, MOLDED ELECTRONICS PACKAGING. |
| 摘要 |
An electromagnetically shielded self-molding package for an electronic component comprises a pair of bags having an electrically conductive coating therebetween and disposed about the component and having a polymerizable resin completely filling the space between the bags and the component. |
| 申请公布号 |
EP0668830(A4) |
申请公布日期 |
1997.03.26 |
| 申请号 |
EP19930918121 |
申请日期 |
1993.06.14 |
| 申请人 |
WILLIAMS INTERNATIONAL CORPORATION |
发明人 |
JONES, ALLEN, M. |
| 分类号 |
B65B53/02;B65B55/20;B65D75/00;H05K3/28;H05K5/00;H05K13/00 |
主分类号 |
B65B53/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
