Semiconductor device having contoured package body profile and method for its fabrication

摘要

An overmolded semiconductor device (30) has a contoured package body profile instead of a conventional flat package body surface for uniform filling during the molding process. A cross-section of the semiconductor device reveals a substantially uniform thickness of plastic (36 and 38) covering the carrier substrate (14) and overmolding the semiconductor die (12). Alternatively, a thicker layer of plastic overmolds the semiconductor die than the layer of plastic covering the carrier substrate. The contoured package body profile is designed to allow a uniform flow front progression of molding compound during the molding process to eliminate voids in the package body by providing the same resistive pressure to the molding compound flow front during filling. The plastic body may have curved or straight contoured edges.