发明名称 |
Article comprising a stacked array of electronic subassemblies |
摘要 |
<p>Disclosed is an article comprising a stacked array of electronic subassemblies, each subassembly including one or more integrated circuits (50) and a thermally conductive base member (15) that is perforated with holes (70). Motivating means (80) are provided for causing a coolant fluid to pass through the holes in a direction substantially parallel to the stacking axis.</p> |
申请公布号 |
EP0410631(B1) |
申请公布日期 |
1997.03.26 |
申请号 |
EP19900307844 |
申请日期 |
1990.07.18 |
申请人 |
AT&T CORP. |
发明人 |
LEE, YUNG-CHENG;SEGELKEN, JOHN MAURICE |
分类号 |
H05K7/20;H01L23/467;H01L25/00;H01L25/065;H01L25/10;(IPC1-7):H01L23/467;H01L23/473 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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