发明名称 Article comprising a stacked array of electronic subassemblies
摘要 <p>Disclosed is an article comprising a stacked array of electronic subassemblies, each subassembly including one or more integrated circuits (50) and a thermally conductive base member (15) that is perforated with holes (70). Motivating means (80) are provided for causing a coolant fluid to pass through the holes in a direction substantially parallel to the stacking axis.</p>
申请公布号 EP0410631(B1) 申请公布日期 1997.03.26
申请号 EP19900307844 申请日期 1990.07.18
申请人 AT&T CORP. 发明人 LEE, YUNG-CHENG;SEGELKEN, JOHN MAURICE
分类号 H05K7/20;H01L23/467;H01L25/00;H01L25/065;H01L25/10;(IPC1-7):H01L23/467;H01L23/473 主分类号 H05K7/20
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