| 摘要 |
To mount and secure electronic components to a substrate, by pressure sintering, a layer (3) of a powder which can be sintered is applied to a contact surface of the component and/or a contact surface (11) of the substrate (1). The contact surfaces are brought together, under pressure, and are heated to the sintering temp. to sinter the bonding layer (3). The layer (3) is deposited by evaporation and condensation of a metal where, at a gas pressure of 100-1000 Pa, a nano-crystal metal powder is formed on the surface(s). The layer (3) is of silver, deposited in a He atmosphere to grow and develop into the layer structure. |
