| 发明名称 |
Tape carrier package semiconductor device |
| 摘要 |
In a TCP (tape carrier package) semiconductor device having opposing, inner lead arrays bonded to a semiconductor device, a projection or projections are provided on each of the inner leads disposed at intervals of a greater distance on one side of the semiconductor, within a range for allowing the resin to flow out.
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| 申请公布号 |
US5614760(A) |
申请公布日期 |
1997.03.25 |
| 申请号 |
US19950386051 |
申请日期 |
1995.02.07 |
| 申请人 |
SHARP KABUSHIKI KAISHA |
发明人 |
OSONO, MITSUAKI;TAJIMA, NAOYUKI;MORI, KATSUNOBU |
| 分类号 |
H01L21/60;H01L21/56;H01L23/28;H01L23/495;(IPC1-7):H01L23/495;H01L23/34;H01L23/48 |
主分类号 |
H01L21/60 |
| 代理机构 |
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代理人 |
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| 主权项 |
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