发明名称 |
BGA semiconductor device including a plurality of semiconductor chips located on upper and lower surfaces of a first substrate |
摘要 |
A semiconductor device includes a first substrate carrying semiconductor chips on both upper and lower major surfaces thereof, a second substrate carrying the first substrate, and a resin package body having a first part for embedding the semiconductor chips on the upper major surface of the first substrate and a second part for embedding the semiconductor chips on the lower major surface of the first substrate, wherein the second substrate carries on a lower major surface thereof solder bumps forming a BGA structure.
|
申请公布号 |
US5615089(A) |
申请公布日期 |
1997.03.25 |
申请号 |
US19950505888 |
申请日期 |
1995.07.24 |
申请人 |
FUJITSU LIMITED |
发明人 |
YONEDA, YOSHIHIRO;OZAWA, TAKASHI |
分类号 |
H01L21/3205;H01L21/56;H01L23/12;H01L23/31;H01L23/498;H01L23/52;H01L25/065;H01L25/07;H01L25/18;(IPC1-7):H05K1/18 |
主分类号 |
H01L21/3205 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|