发明名称 SURFACE-MACHINED SUBSTRATE AND ITS MANUFACTURE
摘要 PROBLEM TO BE SOLVED: To provide a surface-machined substrate free of micro-cracks by grinding a substrate by means of a grinding wheel and under a ductile mode so as to form sector-form machining traces. SOLUTION: The generating-line form of a shoulder of a grinding wheel is adjusted by precise turning, so that the depth of cut of individual abrasive grains becomes lower than the ductility-brittleness transition point (about 50nm) of a carbon substrate. The substrate is fixed by a great many of vacuum suction holes made in a work table, or by a vacuum chucking method, and both surfaces the substrate are machined under a ductile mode. Thus, sector-form machining traces are formed on the surface-machined substrate. In this case, no cross-over of these machining traces is formed. With this, the occurrence of micro-cracks is restricted, while Ra (surface roughness) becomes 1 to 100Åand Rp (projection height)/Ra 2 to 10.
申请公布号 JPH0976147(A) 申请公布日期 1997.03.25
申请号 JP19950256978 申请日期 1995.09.08
申请人 KAO CORP;NISSHIN KIKAI SEISAKUSHO:KK 发明人 YAMAMOTO YUZO;NODA AKIRA;KOBAYASHI MIKIO;DAITO KIYOMASA
分类号 B24B1/00;G11B5/73;G11B5/82;G11B5/84;H01L21/304;(IPC1-7):B24B1/00 主分类号 B24B1/00
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