发明名称 |
Method of producing a frame made of connected semiconductor die mounting substrates |
摘要 |
Method of producing a frame made of connected semiconductor die mounting substrates comprises i) a first step for producing a metal substrate sheet wherein an original material for metal substrate sheet of a desired size is cut out from a metal material and an erosion preventing layer is provided on the entire surface thereof, ii) a second step for producing a circuit substrate sheet wherein the circuit substrate sheet is made of a resin substrate coated with a copper leaf layer and is provided with a lead pattern on the surface thereof in place, iii) a third step for producing a connected semiconductor die mounting substrate sheet by adhering the metal substrate sheet to the circuit substrate sheet, iv) a fourth step for forming a plurality of pilot apertures and slits on the connected semiconductor die mounting substrate sheet by press working and v) a fifth step for producing a plurality of connected semiconductor die mounting substrate frames by separating the connected semiconductor die mounting substrate sheet. |
申请公布号 |
US5614443(A) |
申请公布日期 |
1997.03.25 |
申请号 |
US19960622144 |
申请日期 |
1996.03.27 |
申请人 |
MITSUI HIGH-TEC, INC. |
发明人 |
NAKASHIMA, TAKASHI;TAKAI, KEIJI;TATEISHI, KOUJI |
分类号 |
H01L23/12;H01L21/98;H01L23/50;H01L23/538;H01L25/065;(IPC1-7):H01L21/60 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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