| 摘要 |
Rectangular preforms are vacuum picked and placed in each cavity of a first holder, and a measured amount of no-clean flux liquid is dispensed onto each preform, then a second holder is placed in an inverted position on top of the first holder and the holders are flipped so that the dry side of the preform is exposed and then a measured amount of no-clean solder is dispensed on the dry side of the preform. A robot arm with a rubber tipped vacuum probe picks up the preforms without damage or contamination and places them on a circuit board, grippers of the robot arm pick up and position a component on an induction coil to heat it up sufficient for reflow soldering, and then move the component onto the preform on the circuit board for reflow soldering. The circuit board can be used without cleaning with solvents or CFC's, thus reducing process steps and reducing environmental hazards.
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