| 摘要 |
PCT No. PCT/JP94/00104 Sec. 371 Date Nov. 22, 1994 Sec. 102(e) Date Nov. 22, 1994 PCT Filed Jan. 26, 1994 PCT Pub. No. WO94/18607 PCT Pub. Date Aug. 18, 1994The present invention relates to a method of forming positive polyimide patterns which includes a process wherein a film of a composition of actinic radiation-sensitive polyimide precursor is formed on a substrate which is selectively exposed to an actinic radiation, then such a treatment is applied to the film that the film in unexposed portion attains higher degree of curing than the film in exposed portion after the exposure, and the film is removed from the exposed portion. According to the invention, such an unexpected effect can be achieved as a positive polyimide pattern can be formed by using a composition of actinic radiation-sensitive polyimide precursor which has only been used in forming negative patterns. According to the invention, the positive polyimide pattern can be formed easily and the pattern obtained has excellent performance.
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