发明名称 Integrated circuit capacitors and process for making the same
摘要 A xylene exchange is performed on a stock solution of BST of greater then 99.999% purity dissolved in methoxyethanol, and a carboxylate of a dopant metal, such as magnesium 2-ethylhexanoate is added to form a precursor. The precursor is spun on a first electrode, dried at 400 DEG C. for 2 minutes, then annealed at 750 DEG C. to 800 DEG C. for about an hour to form a layer of accurately doped BST. A second electrode is deposited, patterned, and annealed at between 750 DEG C. to 800 DEG C. for about 30 minutes. Excellent leakage current results if the dopant is magnesium of about 5% molarity. For other dopants, such as Mg, Nb, Y, Bi, and Sn the preferred dopant range is 0.2% to 0.3% molarity. The magnesium-doped material is used as a buffer layer between the electrodes and BST dielectric of an undoped BST capacitor.
申请公布号 US5614018(A) 申请公布日期 1997.03.25
申请号 US19940273592 申请日期 1994.07.11
申请人 SYMETRIX CORPORATION;MATSUSHITA ELECTRONICS CORPORATION 发明人 AZUMA, MASAMICHI;PAZ DE ARAUJO, CARLOS A.;SCOTT, MICHAEL C.;CUCHIARO, JOSEPH D.
分类号 C23C16/44;C23C16/448;C23C16/455;C23C16/46;C23C16/48;C23C16/52;C23C18/12;C23C18/14;C30B7/00;H01C7/10;H01L21/02;H01L21/314;H01L21/316;H01L21/8242;H01L27/108;H01L27/115;(IPC1-7):C30B9/08 主分类号 C23C16/44
代理机构 代理人
主权项
地址