Reflow-plated member and a manufacturing method therefor

摘要

Provided is a method for manufacturing a reflow-plated member, which comprises a process for forming a plated layer of Sn or Sn alloy on the surface of a base material, at least the surface of which is formed of Cu or Cu alloy, by electroplating, and a process for running the base material at a traveling speed equivalent to 80% to 90% of the lowest traveling speed that said plated layer does not melt when the base material is continuously run for reflowing in a heating furnace at a predetermined temperature. The obtained reflow-plated member is excellent in any of properties including solderability, heat resistance, bendability, wear resistance, and corrosion resistance.