发明名称 COPPER FOIL FOR PRINTED WIRING BOARD AND ITS SURFACE TREATMENT
摘要 PROBLEM TO BE SOLVED: To produce a copper foil for printed wiring board having high degree of bright surface property by forming successively layers of a metal, a chromium compound or the like, benzimidazole or the like on the surface layer of a copper foil. SOLUTION: Zinc is deposited on copper of a copper foil 4 bright surface as a 1st layer 1. A 2nd layer 2 is formed thereon. The layer is composed of the chromium compound and a phosphorus compound. A 3rd layer 3 is formed on the 2nd layer. The layer is composed of benzimidazole or its derivative or an alkylimidazole compound. The 1st layer is a layer of a zinc alloy containing one or more kind of Ni, Co, Fe, Cr, Cu, Sn, Ti, W, Mo, Mn, P and S. The 1st layer is formed by electroplating, the 2nd layer is formed by cathodic electrolysis and the 3rd layer is formed by dipping in an aq. solution containing the compound. The method greatly contributes the improvement of the yield in the production of a copper clad laminated board.
申请公布号 JPH0978289(A) 申请公布日期 1997.03.25
申请号 JP19950232437 申请日期 1995.09.11
申请人 FUKUDA METAL FOIL & POWDER CO LTD 发明人 TAKAMI MASATO;HIROSE MASARU
分类号 C23C28/00;C25D11/38;H05K3/38;(IPC1-7):C25D11/38 主分类号 C23C28/00
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