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发明名称
Functional fluid additives for acid copper electroplating baths
摘要
申请公布号
HK28197(A)
申请公布日期
1997.03.21
申请号
HK19970000281
申请日期
1997.03.13
申请人
ENTHONE-OMI INC
发明人
SYLVIA MARTIN
分类号
C25D3/38;(IPC1-7):C25D3/38
主分类号
C25D3/38
代理机构
代理人
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