A MOLDING DEVICE OF SEMICONDUCTOR PACKAGE

摘要

A metal mold is fixed at an up-facing mold press and put to drive. And a lower cavity block(16) of a lower mold(2) fixed at the movable plate of the mold is completely separated from an upper cavity block(12) of an upper mold(1) fixed at a hinge. After a port(4) is supplied by a resin(3), a lead frame is placed on a lower cavity block(16), and the movable plate of the mold press raises to close contact the upper cavity block(12) with the lower cavity block(16). Then the resin(3) is charged into each cavity from the port(4) by the pressure caused by a plunger tip(7).