发明名称 Gehäuse für ein Leistungs-Halbleitermodul
摘要 The housing has a metal base and an upper part of insulating material seated upon the base and with side walls and a top. At least one of the side walls has a region (4,7,9) which opens outwards in the event of a pressure within the housing above a defined level. The region of he side wall can be bounded by at least one groove (6) in the side wall, e.g. by two parallel grooves. The groove or grooves can be arranged on the inside of the side wall. The depth of the groove is greater than half the thickness of the side wall.
申请公布号 DE19534607(A1) 申请公布日期 1997.03.20
申请号 DE1995134607 申请日期 1995.09.18
申请人 EUPEC EUROPAEISCHE GESELLSCHAFT FUER LEISTUNGSHALBLEITER MBH + CO.KG, 59581 WARSTEIN, DE 发明人 HIERHOLZER, MARTIN, DIPL.-ING., 59581 WARSTEIN, DE;SPANKE, REINHOLD, DIPL.-ING., 59909 BESTWIG, DE
分类号 H05K5/00;H01L23/053;H05K5/06 主分类号 H05K5/00
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