发明名称 GRINDING METHOD OF GRINDING DEVICE
摘要 <p>A grinding method which uses grindstone comprising abrasive grains and a binding resin for binding the abrasive grains, and a grinding device for use in the same. Grindstone having a desired elastic modulus can be manufactured by means of a resin for binding abrasive grains. Accordingly, surfaces of a substrate having irregularity can be evenly flattened irrespective of dimensions of irregularity. Further, an abraded surface with less damage can be obtained by performing abrasion with an abrasive tool of a large elastic modulus after abrasion is preformed with an abrasive tool of a small elastic modulus. The present method is effective in flattening the surfaces of various substrates having irregularity.</p>
申请公布号 WO1997010613(P1) 申请公布日期 1997.03.20
申请号 JP1995001814 申请日期 1995.09.13
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