| 摘要 |
<p>PROBLEM TO BE SOLVED: To obtain a wedge tool which can improve the efficiency of bonding work by preventing the floating of a wire by providing a heating means which is detachably attached to the wedge tool, a power supplying means which supplies AC power, and an inserting hole which is formed into a lower projecting stage into which the wire which is passed through the hole is inserted. SOLUTION: In a wedge tool 14 for manufacturing semiconductor element, a heating means which is detachably attached to a prescribed part of the tool 14 and with which the other ends of a pair of heating coils 16 are locked is provided. The tool 14 is also provided with a power supplying means 18 with which the base ends of the coils 16 are tied and which is provided on the outside of the tool 14 and supplies AC power and an inserting hole 20 which is formed into the lower projecting stage 21 of the tool 14 and into which a wire 26 which is passed through the hole 20 is inserted. For example, the heating means can be constituted by forming an inserting groove 15 by engraving a prescribed part of the tool 14 and removably housing a metallic bar 17 in the groove 15, and then, tying the other ends of the coils 16 with the bar 17.</p> |
