| 摘要 |
PROBLEM TO BE SOLVED: To improve the efficiency of hip bonding, to arbitrary adjust the size of bumps in accordance with the thickness of wires, and to accurately and quickly form bumps by forming the bumps by using a wire ball bonding device during the assembling process of a semiconductor chip. SOLUTION: After an Au wire 30 is passed through the capillary 60 of a wire ball bonding device and an Au ball is formed at the front end of the wire 30, the Au ball is stuck to the top of an aluminum bonding pad 20. At the same time, an Au bump 31 is formed by cutting the part of the wire 30 immediately above the Au ball by utilizing a wire clamp 70. Then an Sn/Pb alloy bump is formed so as to cover the Au bump 31. Thereafter, semiconductor chips are arranged on the lead finger of a substrate in an over-turned state and the chips are stuck to the lead finger through heat treatment by passing the substrate through a furnace. Therefore, the process can be shortened in time. |
