| 摘要 |
PROBLEM TO BE SOLVED: To provide a high density mounting semiconductor card which is superior in energy consumption ability and which can execute a highly reliable operation. SOLUTION: Five semiconductor chips 8 are controlled by a control chip 8a. The control chip 8a impresses a bias voltage on the five semiconductor chips 8 being control objects only when the semiconductor chip 8 required for the operation of the card is set to be the control object. Bias voltage impressed on the semiconductor chip 8 is monitored by a bias check part 43, and the monitor result is outputted to an external device and a bias changer 44. Then, the specification/recovery processings of the faulty semiconductor chip 8 is executed. |
