发明名称 LOW-TEMPERATURE FIRED CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To obtain a practical low-temperature fired circuit board, which is superior in the wettability with solder of its surface and has surface wiring conductors maintaining a full adhesive strength also even after a high aging test or a temperature cycle test, by a method wherein V2 O5 is made to contain in the wiring conductors, which contain Ag as their main component, on both surfaces of a base body consisting of a glass-ceramic material. SOLUTION: In a laminated material 1, glass-ceramic layers 1a to 1e are arranged, internal wiring conductors 3 for attaining a prescribed circuit network and for generating a capacitance component are arranged between the layers 1a to 1e and via hole conductors 4, which are made to penetrate the thickness direction of the layers 1a to 1e, are formed. The conductors 3 and 4 consist of a conductor, such as an Ag conductor. Moreover, surface wiring conductors 2 are formed on both main surfaces of the laminated material 1 and the conductors 2 consist of an Ag conductor containing a metallic oxide, V2 O5 . Accordingly, an anchor effect from the glass component of the material for a board to Ag particles in the conductors 2 is accelerated, the stable and firm adhesive strength of the conductors 2 can be maintained extending over a long period of time and the board is formed into a board, which is superior in reliable bonding.
申请公布号 JPH0974256(A) 申请公布日期 1997.03.18
申请号 JP19960014906 申请日期 1996.01.31
申请人 KYOCERA CORP 发明人 SAKANOUE AKIHIRO;MURAKAMI TADASHI;TSUKIJI RIKA
分类号 H05K1/09;H01L21/60;H05K3/46 主分类号 H05K1/09
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