| 摘要 |
PROBLEM TO BE SOLVED: To simplify a manufacturing process to achieve cost reduction by performing the connection of ink passages with a top plate having recessed parts and the sealing of a drive circuit IC part and an electrical connection part by using the same material. SOLUTION: After an ink supply port is attached to a top plate 110 having recessed parts, the necessary parts of ink passages 300 are sealed by a seal resin 310. This seal resin 310 is same to the material used in the resin sealing of the boundary part 320 of the top plate 110 and the ink supply port and the resin sealing of a drive IC 120 and a bonding wire 130 and resin sealing is performed in the same process. As a resin material, there are a silicone type JCR-grade thermosetting resin, a semi-JCR-grade resin with an impurity level of 5ppm or less and a heat curable epoxy type COB chip coating resin. |
