| 摘要 |
A circuit comprising: a multi-layer circuit board (11) including a substrate having a top face and conductive traces (27) extending through its volume between differing layers, and a series of holes (23) extending from a surface of the circuit board into its volume a sufficient length through one or more of said layers to expose a portion of said conductive traces associated therewith; a conductive material (29) disposed in each of said series of holes and contacting the exposed portion of the conductive traces; and a semiconductor flip chip (12, 13, 15) having a series of metallic bumps (19) extending from input-output pads and connected to circuitry on the chip and partially extending into said holes, the metallic bumps (19) being in contact with said conductive material thereby making electrical connection to the traces via said conductive material, and said flip chip having a bottom face lying flush against portions of the top face of the circuit board. |
