| 摘要 |
Ball grid array devices are mounted in a burn-in and test socket which has a top surface with windows for the ball terminals depending from the ball grad array device. Contact fingers mounted on the base of the socket extend through a bending plate and into the windows from the opposite side of the top surface. When the bending plate is moved laterally with respect to the top surface, the ends of the contact members are moved into contact with the ball terminals. The ends of the contact members are urged into contact with the ball terminals between the center of the ball terminal and the surface of the ball grid array device, thus retaining the device in the socket.
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