发明名称 |
Clamping heat sink |
摘要 |
A clamping heat sink formed of a thermally conductive material for releasable attachment to an electronic component. The clamping heat sink includes a horizontal base wall, a pair of vertical side walls extending upwardly from the base and a resiliently deflectable clamping element which extends downwardly from the top of each vertical wall into the rectangular channel which is formed by the base wall and vertical side walls. Each clamping element has an upper portion which extends downwardly at any angle toward the base wall and the opposite side wall and a lower portion which extends downwardly at an angle from the lower end of the upper portion toward its own side wall, the upper portion of the clamping element forming a juncture with the lower portion. Each vertical side wall has an opening which is horizontally aligned with its respective clamping element to enable the clamping element to be deflected into the opening when a semiconductor package is passed between the clamping elements, prior to positioning of the semiconductor package on the base wall of the clamping heat sink.
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申请公布号 |
US5611393(A) |
申请公布日期 |
1997.03.18 |
申请号 |
US19960609770 |
申请日期 |
1996.02.23 |
申请人 |
WAKEFIELD ENGINEERING, INC. |
发明人 |
VASCONCELOS, OSVALDO M.;CAMPANELLA, VINCENT |
分类号 |
H01L23/367;H01L23/40;(IPC1-7):F28F7/00;H01L23/02 |
主分类号 |
H01L23/367 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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