发明名称 |
Integrated electro-optical package |
摘要 |
An integrated electro-optical package including an optically transparent substrate with a large array of light emitting devices formed thereon and cooperating to generate a complete real image. The light emitting devices are positioned in rows and columns and connected to pads adjacent outer edges of the substrate. A driver substrate having mounting pads, bump bonded to the pads on the substrate. A plurality of driver circuits connected to the light emitting devices through terminals on the driver substrate. A lens mounted to the substrate over the array of light emitting devices and on a side opposite to magnify the real image and produce an easily viewable virtual image.
|
申请公布号 |
US5612549(A) |
申请公布日期 |
1997.03.18 |
申请号 |
US19940217000 |
申请日期 |
1994.03.24 |
申请人 |
MOTOROLA |
发明人 |
NELSON, RONALD J.;STAFFORD, JOHN W.;HARVEY, III, THOMAS B. |
分类号 |
G09F9/33;H01L25/16;H01L33/00;H01L51/50;(IPC1-7):H01L31/023 |
主分类号 |
G09F9/33 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|