| 摘要 |
PROBLEM TO BE SOLVED: To improve the strength of an IC card by a method wherein an IC is imbedded with sealing resin in a lead frame material made of band metal plate under the condition that the sealing resin is afterwards covered with a card core sheet so as to cut the resultant lead frame material at a low temperature lower than the normal temperature by the predetermined temperature. SOLUTION: In a lead frame material 30, a portion 31 consisting of a lead frame 3 is divided into a plurality of small pieces 31a, which are connected through connecting pieces 32 with rib parts on both sides, so as to constitute the circuit of an IC card. After being die-bonded to an IN mounting part 31b, an IC 2 is wire-bonded through metal wires 4 so as to be electrically connected with the respective small pieces 31a. Sealing resin 5 is patted on the bonded IC 2 and metal wires 4. Next, the sealing resin 5 is imbedded in the recessed part 1a of band vinyl chloride plate material 10 serving as a card core sheet. The resultant lead frame material is cut at a low temperature lower than the normal temperature by the predetermined temperature. |
