摘要 |
<p>PROBLEM TO BE SOLVED: To miniaturize a unit by forming a connector housing with a frame surrounding the periphery of bare chips and filled with a sealing resin and terminals protruded into the frame in the unit provided with a board mounted with the bare chips and the connector housing fixed to the board. SOLUTION: Power MOS-FET elements are used for bare chips 1A-1C in an automatic light unit serving as an electrical unit for a vehicle, and they are mounted on a board 2 made of a metal material such as aluminum via chip dies 6. A connector housing 3 provided with a frame 31 and terminals 32 is fixed to the board 2. The frame 31 is filled with a sealing resin 4, and it is formed to surround the periphery of the bare chips 1A-1C. The terminals 32 and the bare chips 1A-1C are electrically connected by bonding wires 5, then the sealing resin 4 is filled into the frame 31 to seal the bare chips 1A-1C.</p> |