| 摘要 |
PROBLEM TO BE SOLVED: To obtain a resin-sealed semiconductor device which is produced by sealing the film carrier and the IC chips with an epoxy resin composition, causes no warpage of the package because of its good resin-filling properties and is excellent in soldering heat resistance and reliability. SOLUTION: This semiconductor device comprises the film carrier having device holes bored, leads set on the carrier, the IC chips connected to the leads and a cured epoxy resin composition sealing the IC chips. This resin composition contains (A) an epoxy resin comprising a resin of the skeleton of the formula (R<1> to R<8> are each H, a halogen, a 1-4C alkyl) as an essential component, (B) a curing agent and (C) a filler in an amount of 65-82wt.% of the total composition (for example, spherical bused silica with an average particle size of 5-30μm or <=2μm or crushed fused silica with an average particle size of 4-17μm) and the lowest melt viscosity at the molding temperature of this composition is adjusted to 0.1-10Pa.S.
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