SUBSTRATE POLISHING DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a substrate polishing device which can improve uniformity in a face and prolong the service life of a polishing pad simultaneously when a substrate is polished. SOLUTION: It is a substrate polishing device which performs polishing treatment by pressing a substrate 31 which is attached adhesively and held by a chuck plate 24 of a polishing head 3 against a surface of a polishing pad which is stretched on a polishing plate with the predetermined polishing pressurizing force. It is provided with a chuck face compensation mechanism consisting of a chamber 26 formed on the opposite side to a substrate hold face of the chuck plate 24 and an air supply and exhaust device 30 which changes air pressure in the chamber 26 through an air supply and exhaust port 28 communicating with the chamber 26 so that the chuck plate 24 is elastically and forcedly deformed in the direction of polishing and pressurization in accordance with the shape of the surface of the polishing pad.