发明名称 Method and apparatus for conditioning of chemical-mechanical polishing pads
摘要 A method and apparatus for conditioning and/or rinsing a pad in a chemical-mechanical polisher. A scoring apparatus is rotated about its center directly over the polishing pad of the chemical-mechanical polisher. The scoring apparatus scores the pad surface while rotating above the pad. Consequently the pad is conditioned in a uniform and concentric fashion.
申请公布号 US5611943(A) 申请公布日期 1997.03.18
申请号 US19950536467 申请日期 1995.09.29
申请人 INTEL CORPORATION 发明人 CADIEN, KENNETH C.;YAU, LEOPOLDO D.
分类号 B24B37/04;(IPC1-7):B24B29/00 主分类号 B24B37/04
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