发明名称 |
Method and apparatus for conditioning of chemical-mechanical polishing pads |
摘要 |
A method and apparatus for conditioning and/or rinsing a pad in a chemical-mechanical polisher. A scoring apparatus is rotated about its center directly over the polishing pad of the chemical-mechanical polisher. The scoring apparatus scores the pad surface while rotating above the pad. Consequently the pad is conditioned in a uniform and concentric fashion.
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申请公布号 |
US5611943(A) |
申请公布日期 |
1997.03.18 |
申请号 |
US19950536467 |
申请日期 |
1995.09.29 |
申请人 |
INTEL CORPORATION |
发明人 |
CADIEN, KENNETH C.;YAU, LEOPOLDO D. |
分类号 |
B24B37/04;(IPC1-7):B24B29/00 |
主分类号 |
B24B37/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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