摘要 |
In an improved process for fabricating thin film head sliders from a wafer on one face of which a plurality of electromagnetic devices are arranged in rows, a single-row is mechanically processed to form sliders while it remains an integral part of the wafer, or after it is bonded to a fixture under a condition which induces no bow on the bar. Alternatively, double-row bar sliced from the wafer is used for fabrication of sliders, wherein each single-row bar is mechanically processed while it remains an integral part of the double-row bar, or after it is bonded to a fixture as an integral part of a double-row bar followed by severance of the bonded double-row bar into two single-row bars. The process eliminates or materially reduces any inducement of bow of the bar, which is a serious cause of throat height control problem associated with the prior fabrication methods.
|