| 摘要 |
A composite floor pad assembly includes a pair of interchangeable and reversible floor polishing pads having identical external diameters and central openings therethrough of an identical diameter. An intermediate connecting member having a plurality of hook-like members projecting from opposite surfaces thereof and provided with a central opening is detachably connected to opposing surfaces of the two floor polishing pads. A truncated, conical mandrel is also provided over which the pads and connecting member may be placed to facilitate alignment of the pads. The mandrel may be provided with an attachment member for detachably connecting the mandrel to an upper surface of a floor polishing machine.
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