| 摘要 |
A solder deposit support for the selective soldering of connecting surfaces on a substrate, having, on an electrically conductive, unwettable or wetting-inhibiting coating (12), a transfer mask (13) of an electrically insulating, unsolderable material revealing the coating in the region of mask apertures (14), in which the mask apertures (14) are used to accept solder deposits (16) applied galvanically to the coating (12) and the coating (12) has two superimposed metal layers (15, 17) of different materials in such a way that the layer (17) facing the mask apertures (14) is unwettable or inhibits wetting and the layer (15) away from the mask apertures (14) acts as a current-conducting layer during galvanic appplication. |
