| 摘要 |
<p>A polyoxymethylene resin composition comprising (A) 100 parts by weight of a polyoxymethylene resin and (B) 0.01 to 10 parts by weight of a vinyl polymer having primary amide groups and amide groups, being excellent in heat stability in molding and weathering resistance, and being suitably usable as the molding material for electrical and electronic components and automobile parts.</p> |
