Low temp. and pressure, direct bonding of nitride surface

摘要

Direct bonding of the nitride surface of a first body (13) to the surface of a second body (14) involves: (a) cleaning the surfaces of the bodies; (b) terminating the bonds of the nitrogen atoms at the surface of the first body (13) with hydrogen atoms; and (c) bonding the surfaces of the bodies using the bonds of the hydrogen atoms. Step (b) is carried out by chemical etching with dil. hydrofluoric acid or by using a hydrogen plasma (36), produced by electron cyclotron resonance or by a radical beam source in vacuum.