| 摘要 |
<p>A polishing apparatus polishes a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a storage cassette (2a,2b) for storing workpieces to be polished, at least two polishing units (1a,1b) each having at least a turntable (9) with a polishing cloth mounted thereon and a top ring (6) for supporting a workpiece and pressing the workpiece against the polishing cloth, and a cleaning unit (7a,7b,8a,8b) for cleaning a workpiece which has been polished by either one of the polishing units in such a state that the workpiece is removed from the top ring. The polishing apparatus further includes a transfer robot (4a,4b) for transferring a workpiece between two of the storage cassette, the polishing units and the cleaning unit. <IMAGE></p> |
