Tape carrier package structure with reinforced outer leads

摘要

A highly reliable assembly structure is provided by surely reducing a stress to be exerted on leads (12) of a TCP device (10). Part of a soldered portion of outer leads (12b) that is located closer to a semiconductor chip (11) of the TCP device (10) is reinforced by a support ring (14) formed on a side of the outer leads (12b) opposite from a circuit board (20), so that a stress to be exerted on the outer leads (12b) is dispersed to the leads (12), the support ring (14) and solder (31) to thereby prevent the possible occurrence of metal fatigue of the leads (12).