发明名称 POLYACETAL RESIN COMPOSITION EXHIBITING HIGH RETENTIVITY OF MECHANICAL STRENGTHS
摘要 <p>The invention provides a ployacetal resin composition comprising 100 parts by weight of a polyacetal resin having a melting point of 150 to 161 DEG C, 0.01 to 5.0 parts by weight of at least one bisamide compound represented by general formula (1), and 0.0001 to 5.0 parts by weight of at least one monoamide represented by general formula (2), wherein R<1>, R<3> and R<6> are each independently alkyl or alkenyl; and R<2> and R<7> are each independently alkylene, alkenylene or - R<4> - Ph - R<5> - wherein R<4> and R<5> are each independently a single bond or methylene. This composition is excellent in the retention of mechanical strengths under thermal shock and is therefore reduced in whitening, cracking, fracture, lowering in impact strength, and so on after the application of thermal shock. Accordingly, the composition is applicable to uses involving repeated exposure to heating and cooling. The invention also discloses an insert-molded article which is constituted of the above composition and a shaped part integrated with the composition by insert molding and whose mechanical strengths are excellently resistant to thermal shock.</p>
申请公布号 WO9709382(A1) 申请公布日期 1997.03.13
申请号 WO1996JP02512 申请日期 1996.09.05
申请人 ASAHI KASEI KOGYO KABUSHIKI KAISHA;YOKOYAMA, HIROSHI;ARIYASU, HIDEYUKI;NAGAHARA, HAJIME 发明人 YOKOYAMA, HIROSHI;ARIYASU, HIDEYUKI;NAGAHARA, HAJIME
分类号 C08K5/13;C08K5/20;(IPC1-7):C08L59/00;B29C45/14;B29C45/00 主分类号 C08K5/13
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