摘要 |
<p>A processing system for processing of wafers (22a) that are formed by slicing a cylindrical workpiece (22) which is adhered to a support plate (23) by an adhesive agent (23c). The processing system includes a washing apparatus (24), a removing apparatus(27), a separating apparatus(28), and a transferring apparatus (32, 34, 35, 36, 38). The washing apparatus (24) washes the wafers (22a) that are remained adhered to the support plate (23). The removing apparatus (27) removes a group of the wafers (22a) from the support plate(23). The removed wafers (22a) are gathered in a cylindrical shape. The separating apparatus (28) separates the wafers (22a) one by one. The separating apparatus (28) includes a vessel (29; 295) for accommodating the wafers (22a) separated one from another. The transferring apparatus (32, 34, 35, 36, 38) transfers the wafers (22a) from the washing apparatus (24) to the removing apparatus (27) and then to the separating apparatus (28). <IMAGE></p> |
申请人 |
NIPPEI TOYAMA CORPORATION |
发明人 |
MIYAZAKI, TAKESHIRO;TSUBATA, YOSHIKAZU;KAWAKITA, AKIO;KATSUMATA, NOBORU;NAKAYAMA, AKIHIRO;HARADA, TOYOKAZU;TAKAKU, MITSUO;YOSHIDA, SYUNSO |