| 摘要 |
<p>A method of manufacturing a circuit assembly is provided. The circuit assembly (10) manufactured according to the present invention includes a circuit board (12) and a heat sink (22). The circuit board (12) has a first side (16) and a second side (20), and each of these sides (16, 20) has one or more electronic components (14, 18) mounted thereon. The heat sink (22) also includes a first side (34) and a second side (43), the first side (34> having a recessed portion (24) therein. The method of manufacturing the circuit assembly (10) includes the step of dispensing a heat curable adhesive (26) between the mating surfaces (30, 32) of the second side (20) of the circuit board (12) and the first side (34) of the heat sink (22). The method also includes the step of positioning the circuit board (12) such that the component (18) on its second side (20) is aligned with the recessed portion (24) of the heat sink (22). The method further includes the step of urging the mating surfaces (30, 32) towards one another and applying heat through the heat sink (22) to cure the adhesive (26). <IMAGE></p> |
