| 摘要 |
<p>The invention provides an outer lead bonding apparatus for bonding a plurality of leads extending outwardly of a semiconductor chip to bonding pads mounted on a substrate, the apparatus including (a) a bonding-aid member having a central portion and a marginal portion, the semiconductor chip being to be adhered to a lower surface of the central portion of the bonding-aid member, the bonding-aid member being to be adhered at the marginal portion thereof to the substrate, the bonding-aid member being formed with an opening for exposing distal ends of the leads at which the leads are to be bonded to the bonding pads, (b) a device for ascertaining whether the leads align with the bonding pads, and (c) a bonding tool having compressing portions for compressing the leads to the bonding pads, the compressing portions having a cross-section to be able to pass through the opening of the bonding-aid member. The invention makes it possible to avoid misalignment of the leads of a semiconductor chip to the bonding pads by simpler arrangement than prior apparatuses.</p> |
