| 摘要 |
An electrostatic protection device for use in a semiconductor integrated circuit, includes a base region of a first conductivity type formed at a principal surface of a semiconductor substrate, a plurality of collector regions constituted of a plurality of first diffused regions of a second conductivity type opposite to the first conductivity type. The first diffused regions are formed on a surface of the base region in the form of a plurality of strips parallel to each other but separate from each other. Emitter regions are constituted of a second diffused region of the second conductivity type formed in the form of a strip between each pair of adjacent collector regions of the plurality of collector regions and a third diffused region of the second conductivity type formed under a contact hole formed in at least one portion of a boundary region at a side of the second diffused region adjacent to the collector region, the third diffused region being connected to the second diffused region. A base contact region of the first conductivity having a high impurity concentration is formed within the base region so as to substantially surround the collector regions and the emitter regions.
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