| 摘要 |
<p>PROBLEM TO BE SOLVED: To obtain an adhesive tape for electronic parts which is excellent in room-temp. adhesive strength, heat resistance, and reliability by forming an adhesive layer comprising a specific polyimide on a heat-resistant film. SOLUTION: This tape is obtd. by forming, on at least one side of a heatresistant film (e.g. a polyimide film), an adhesive layer comprising at least one polyimide which comprises 95-40mol% at least one kind of structural unit selected from among structural units represented by formulas I (wherein Ar is a group represented by formula III) and II and 5-60mol% at least one kind of structural unit selected from among structural units represented by formulas IV (wherein R is a 1-10C alkylene or CH2 OC6 H4 of which the methylene group is bonded to Si; and (n) is 1-20) and V. If necessary, a filler (e.g. silica) having a particle size of 1μm or lower is incorporated into the adhesive layer.</p> |
