| 摘要 |
<p>PROBLEM TO BE SOLVED: To reduce the running cost while enhancing the quality of a processed wafer through a simple system by adjusting the relative position of a board at first and second delivery positions such that a second group of substrates are inserted into the gap of first group of substrates without touching. SOLUTION: A pair of slide cables 21, 22 can be moved reversely with respect to Y direction by means of a slide mechanism and an air cylinder for driving the slide mechanism provided for each slide table. First and second delivery positions are adjusted relatively by adjusting the relative position of carriers C for respective slide cables 21, 22. When a carrier CTR receives a first water group by means of a chuck 72 at the first delivery position and carries the first wafer group to the second delivery position, a second wafer group can be shifted to the second delivery position by means of a second elevating/ lowering member 22a and inserted into the gap of first wafer group.</p> |
