| 摘要 |
PROBLEM TO BE SOLVED: To effectively connect two interconnections disposed via an insulating film in a viahole. SOLUTION: The multilayered circuit board is formed by sequentially covering a board 1 with first interconnection group made of a plurality of interconnections 2 and a second interconnection group made of an insulating film 3 and a plurality of interconnections 4, and electrically connecting the interconnections 2 of the first group and the interconnections 4 of the second group through a viahole conductor (part of the interconnections 4) filled in a viahole 3a provided at a predetermined position of the film 3. The interconnection width w1 of the first group disposed directly under the viahole 3a provided at the film 3 is narrowed as compared with the diameterϕof the viahole 3a to provide a gap between the inner wall of the viahole 3a and the end of the interconnection 2 of the first group. |
