发明名称 |
Cube maskless lead open process using chemical mechanical polish/lead-tip expose process |
摘要 |
A semi-conductor device having a conductive lead with an exposed tip disposed within a first insulative material, which is in turn disposed between insulated first and second integrated circuit chips is disclosed. The first insulative material is etched to form a recess after which a second insulative material is deposited on the access plane of the chips and within the recess. The tip of the wire lead is then exposed by either a chemical mechanical polish or by a wet etch/develop process. |
申请公布号 |
US5609772(A) |
申请公布日期 |
1997.03.11 |
申请号 |
US19950463537 |
申请日期 |
1995.06.05 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
DAUBENSPECK, TIMOTHY H.;HOLMES, STEVEN J.;FERENCE, THOMAS G. |
分类号 |
H01L21/98;H01L25/065;(IPC1-7):C03C15/00;C03C25/06;C23F1/00;B44C1/22 |
主分类号 |
H01L21/98 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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